A Case Study in Compliance with SAϕIC™

Active EMI Management and the Challenge in Using It

Active EMI management is the use of “Active Components” which are commonly referred to as “Spread Spectrum” Integrated Circuits (ICs) to solve the EMI / RFI problems of electronic systems. These are typically used in conjunction with passive components such as capacitors, resistors, inductors, shielding etc. (Refer to “An Introduction to Active EMI/RFI Management”).
The dominant architecture used in current (1st-Gen) Active EMI ICs is based on Phase Locked Loops (PLLs), which are used to Frequency Modulate the offending periodic signal.
These techniques, though effective in certain cases suffer from the following inherent limitations:

1) Intrinsic jitter caused by the PLL, which impacts the modulation efficiency.
2) High power consumption due to the significant amount of analog circuitry.
3) Large part-to part variations due to the typical shifts in the IC manufacturing process.
4) Performance changes due to in-system operating Voltage and Temperature excursions.

These issues have prohibited widespread adoption of this technology especially in timing and power sensitive applications. This is becoming increasingly evident in today’s ever-growing world of high speed interconnected mobile devices.

Compliance at Every Level

Electronic systems today are highly integrated and support numerous interfaces such as USB, HDMI, and Ethernet to name a few. These systems must secure compliance both from an EMI/RFI point as well as from a functional level (system interoperability). This functional compliance requires certification that the system meets the strict timing requirements of the interface.

To illustrate this, a case study is presented in this article to compare the current 1st-Gen technology with LFC Semiconductor’s next-Gen SAϕIC™ technology. (For more information refer SAϕIC™ Technology – The New Way To Compliance ).